sifooyinka alaabta:
| NOOCA | SHARAX |
| qaybta | Isku-dhafka Wareegga (IC) Ku-xidhan - FPGA (Array-ka Iridda Barnaamijku ka dhici karo) |
| soo saaraha | AMD Xilinx |
| taxane | Spartan®-6 LX |
| Xidhmada | saxaarad |
| heerka wax soo saarka | kaydka ku jira |
| Tirada LAB/CLB | 1139 |
| Tirada walxaha macquulka ah / cutubyada | 14579 |
| Wadarta xariijimaha RAM | 589824 |
| Tirada I/O | 232 |
| Voltage - Ku shaqeeya | 1.14V ~ 1.26V |
| nooca rakibaadda | Nooca Buur Dusha |
| Heerkulka shaqada | -40°C ~ 100°C (TJ) |
| Xidhmada/Xiritaanka | 324-LFBGA, CSPBGA |
| Baakadaha Aaladda Alaabta | 324-CSPBGA (15x15) |
| Lambarka alaabta aasaasiga ah | XC6SLX16 |
ka warbixi cilad
Raadinta Parametric Cusub
Kala soocida Deegaanka iyo Dhoofinta:
| SIFOOYINKA | SHARAX |
| Heerka RoHS | Waafaqsan tilmaanta ROHS3 |
| Heerka Dareenka Qoyaanka (MSL) | 3 (168 saacadood) |
| Heerka GAAR | Alaabooyin aan GAAR lahayn |
| ECN | 3A991D |
| HTSUS | 8542.39.0001 |
Xusuusin:
1. Dhammaan danabku waxay ku dhow yihiin dhulka.
2. Fiiri Interface Performs for Interfaces Memory ee Jadwalka 25. Baaxadda waxqabadka la dheereeyay waxaa lagu qeexay naqshado aan la isticmaalin
heerka korantada VCCINT.Qiyaasta korantada caadiga ah ee VCCINT waxaa loo isticmaalaa:
• Naqshado aan isticmaalin MCB
Qalabka LX4
Qalabka ku jira baakadaha TQG144 ama CPG196
• Aaladaha leh darajada xawaaraha -3N
3. Hoos u dhaca danabka ugu badan ee lagu taliyay ee VCCAUX waa 10 mV/ms.
4. Inta lagu jiro qaabaynta, haddii VCCO_2 ay tahay 1.8V, markaas VCCAUX waa inay noqotaa 2.5V.
5. Aaladaha -1L waxay u baahan yihiin VCCAUX = 2.5V marka la isticmaalayo LVDS_25, LVDS_33, BLVDS_25, LVPECL_25, RSDS_25, RSDS_33, PPDS_25,
iyo PPDS_33 Heerarka I/O ee agabka.LVPECL_33 laguma taageero aaladaha -1L.
6. Xogta habaynta waa la hayaa xataa haddii VCCO ay hoos ugu dhacdo 0V.
7. Waxaa ku jira VCCO ee 1.2V, 1.5V, 1.8V, 2.5V, iyo 3.3V.
8. Nidaamyada PCI, gudbiyaha iyo qaataha waa inay lahaadaan sahay guud oo loogu talagalay VCCO.
9. Aaladaha leh darajada xawaaraha -1L ma taageeraan Xilinx PCI IP.
10. Ha dhaafin wadar ahaan 100 mA bangigiiba.
11. VBATT ayaa looga baahan yahay si ay u ilaaliso batteriga ku xiran RAM (BBR) AES furaha marka VCCAUX aan la isticmaalin.Marka VCCAUX la codsado, VBATT waxay noqon kartaa
xiriir la'aan.Marka BBR aan la isticmaalin, Xilinx waxay ku talinaysaa in lagu xidho VCCAUX ama GND.Si kastaba ha ahaatee, VBATT waxa ay noqon kartaa mid aan xidhiidhsanayn.Spartan-6 FPGA Xogta Xaashida: DC iyo sifooyinka beddelka
DS162 (v3.1.1) Janaayo 30, 2015
www.xilinx.com
Tilmaamaha Alaabta
4
Shaxda 3: Shuruudaha Barnaamijyada eFUSE (1)
Tilmaamaha Calaamadaha Min Nooca ugu badan
VFS(2)
sahay koronto dibadda ah
3.2 3.3 3.4 V
IFS
VFS sahayda hadda
--40mA
VCCAUX danab sahayda caawimada ah marka loo eego GND 3.2 3.3 3.45 V
RFUSE(3) iska caabiyaha dibadda ee pin RFUSE ilaa GND 1129 1140 1151
Ω
VCCINT
Korantada sahayda gudaha marka loo eego GND 1.14 1.2 1.26 V
tj
Kala duwanaanta heerkulka
15-85 °C
Xusuusin:
1. Tilmaamahani waxay khuseeyaan inta lagu jiro barnaamijka furaha eFUSE AES.Barnaamijyada waxaa lagu taageeraa oo keliya JTAG. Furaha AES waa kaliya
lagu taageeray aaladaha soo socda: LX75, LX75T, LX100, LX100T, LX150, iyo LX150T.
2. Marka aad barnaamijka eFUSE samaynayso, VFS waa in ay ka yaraataa ama la mid noqotaa VCCAUX.Marka aan barnaamijka la samayn ama marka eFUSE aan la isticmaalin, Xilinx
waxay ku talinaysaa in VFS lagu xidho GND.Si kastaba ha ahaatee, VFS waxay noqon kartaa inta u dhaxaysa GND iyo 3.45 V.
3. RFUSE resistor ayaa loo baahan yahay marka la barnaamijeynayo furaha eFUSE AES.Marka aan barnaamijka la samayn ama marka eFUSE aan la isticmaalin, Xilinx
waxay ku talinaysaa in pin RFUSE lagu xidho VCCAUX ama GND.Si kastaba ha ahaatee, RFUSE waxay noqon kartaa mid aan xidhnayn.
